Our elastic sealing materials are based on silicone and modified‑silyl polymer technology. After curing, they form highly flexible, stress‑relieved rubber layers that seal against moisture, dust and thermal cycling. A broad selection of one‑component moisture‑cure and two‑component mix‑to‑cure grades are available. These sealants bond well to most common engineering substrates, including challenging low‑surface‑energy materials without complicated surface pretreatment. Formulated non‑corrosive, they are safe for sensitive electronics such as printed circuit boards and flexible circuits. Excellent aging‑resistance performance survives temperature shock, high‑temperature‑high‑humidity and salt‑spray testing. Typical applications include FIPG gasket replacement, conformal coating and ITO protective coating for display‑related manufacturing.
