Electrically Conductive Adhesive

Electrically Conductive Adhesive

Electrically Conductive Adhesive (ECA) is silver‑filled acrylate‑based bonding material. It replaces traditional solder joints to create reliable electrical pathways while bonding components together.

Our portfolio includes both heat‑cure and room‑temperature‑cure grades. The heat‑curing conductive silver adhesive is optimized for fine‑pattern precision dispensing, featuring low out‑gassing and low‑stress bonding performance for general‑purpose electronic assembly. The room‑temperature rapid‑cure conductive adhesive is specially engineered for display glass conduction and static‑elimination applications.

All grades feature low volume resistivity, good thermal conductivity, excellent wet‑out and adhesion across many substrates, delivering high stability for long‑term electronic operation.

Features:

  • Excellent electrical properties

  • A variety of materials, a variety of curing methods, suitable for different occasions

  • Excellent thermal conductive

  • Excellent wettability and adhesion

  • High stability and reliability

Advantage:

  1. Lead‑free solder‑replacement solution:Conductive adhesive bonds without high‑temperature soldering heat damage to sensitive components.

  2. Fine‑pattern precision dispensing performance:Low‑viscosity options support ultra‑fine trace printing & micro‑dot dispensing for compact electronics.

  3. Wide conductivity selection:Volume resistivity from 1.0×10⁻⁴ to 4.0×10⁻³ ohm·cm, you can select grades for signal conduction or heavy‑current paths.

  4. Flexible curing workflow:Both heat‑accelerated fast‑cure and room‑temperature cure grades available, match high‑speed SMT or heat‑sensitive parts.

  5. Multi‑function material:Combines bonding, electrical conduction, EMI shielding and ESD‑static dissipation in one product.

Application:

‑ Electrical interconnection for PCB, FPC and surface‑mount components

‑ Conductive bonding for LCD, TFT, CF display glass modules

‑ EMI electromagnetic shielding bonding

‑ ESD electrostatic discharge & static‑elimination applications

‑ Replacement of low‑temperature solder joints

‑ Consumer electronics, wearable devices, sensor assembly

‑ Automotive electronic circuit interconnection

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