Electronic Adhesive

Heat dissipation management has become a core challenge for miniaturized modern electronics. Our thermal‑conductive silicone & MS‑polymer product portfolio provides reliable non‑conductive thermal‑interface solutions, to stabilize long‑term performance and reliability for PCB assemblies and electronic components. Three major product categories are available: potting compound, thermal bonding adhesive and gap filler. Thermal conductivity grades range from low, medium to high. The paste is easy‑to‑dispense and rework‑friendly, featuring low‑stress, low‑bleed, excellent aging‑resistance and non‑corrosive formula, safe for PCB, FPC and precision electronics.

Our elastic sealing product portfolio covers silicone and modified‑silyl (STP / MS‑polymer) materials. They deliver reliable sealing and long‑term protection for electronic components, greatly extending service life and stability even under harsh working environments. With outstanding adhesion to plastic, metal, glass, ceramic and hard‑to‑bond low‑surface‑energy substrates, these flexible sealants are widely adopted for FIPG in‑situ‑formed‑gasket, conformal coating, ITO protection, PCB & FPC precision electronics sealing. Low‑modulus, low‑stress and non‑corrosive properties prevent sensitive circuits from damage.

This series of two-component structural adhesives encompasses three major product lines: 2K epoxy resin, 2K acrylate, and 2K polyurethane, offering highly flexible customization options in terms of application methods, curing speeds, and product performance. They can meet demanding conditions requiring abrasion resistance, bond strength, temperature resistance, and mechanical shock resistance; heating, moisture, UV, or composite curing solutions are available. The products are solvent-free and halogen-free, possessing excellent dimensional stability, high peel strength, and chemical resistance. They are UL, NSF, and other industry certifications and are widely used in consumer electronics, laptop casings, displays, and structural bonding of dissimilar metal-plastic materials.

This series of single-component UV-curable adhesives cures rapidly upon exposure to ultraviolet light. The product line is divided into three main types: pure UV curing, UV moisture dual curing, and UV heat dual curing. A wide range of viscosities are available, and they exhibit excellent adhesion to various substrates including metals, glass, ceramics, LCP, FPCB, PC, and PVC. Anaerobic/moisture secondary curing is possible in shaded areas, making them suitable for high-speed automated production lines. Customized models with flexible low modulus, yellowing resistance, and low stress are also available, widely used in electronic assembly scenarios such as solder joint protection, LCD reinforcement, wire reinforcement, camera module bonding, circuit board protection, and conformal coating.

This series of high‑performance one‑component epoxy adhesives consists of two major product lines: low‑temperature‑cure type and heat‑cure type. Developed to follow the trend of slimmer, lighter and miniaturized electronic products, they are suitable for bonding low‑surface‑energy substrates such as FPC, PCB and LCP, as well as board‑level component protection.

The low‑temperature‑cure series enables fast curing at 70‑80°C, while heat‑cure grades deliver high reliability against drop, shock and thermal cycling. A wide selection of specialized formulations are available, including reworkable, low‑stress, low‑CTE, fluorescence‑detectable and auto‑dispensing grades. They are widely used in the assembly of consumer‑electronic products such as camera modules, fingerprint sensors, WLCSP, BGA chips and wearable devices.

HM's line of reactive hot melt adhesives includes products that are specifically designed for mobile device assembly. Our products are designed to cover a broad spectrum of applications from touch panel assembly to mobile phone parts bonding, by providing a range of performance characteristics including impact, chemical, moisture, and temperature resistance

Jiwei New‑Material (HM) is a national high‑tech and specialized‑refined‑innovative manufacturer founded in 2009. We supply a full‑series industrial adhesive portfolio, covering reactive hot‑melt glue, epoxy adhesive, UV‑curing glue, structural adhesive, elastic sealant, thermal‑conductive material, conductive adhesive and adhesive film. With complete quality certifications, independent R‑D laboratory and overseas production bases in Malaysia and Vietnam, we deliver customized bonding solutions for consumer electronics, new‑energy automobile and semiconductor industries, serving clients from more than 20 countries worldwide.