Electronic Adhesive
We develop and manufacture high‑performance industrial adhesives including PUR Hot‑Melt, Epoxy, Light Curable, Structural Bonding, Elastomeric Material, Electrically Conductive and Film Adhesive. Offering standard grades and ODM custom formulations, our adhesives satisfy bonding, sealing and thermal‑management needs for consumer electronics, new‑energy vehicles and semiconductors, complying with IATF16949, ISO quality standards for global manufacturers.
Features:
Rich full‑range product lineup, covering bonding, sealing, heat dissipation, electric conduction and thin‑film bonding demands
Eco‑friendly low‑VOC formula options for every series
Compatible with automatic dispensing, laminating and high‑speed assembly production lines
Ready‑made standard specifications and customizable formulas for unique working conditions
Passed strict reliability tests: high‑low temperature cycle, damp‑heat ageing, thermal shock, drop‑resistance and insulation inspection
In‑house complete testing equipment for thermal, mechanical, electrical property and failure analysis
Multi‑site production bases inside China and Southeast‑Asia for stable global supply
Advantage:
✅ Complete full‑category adhesive supplier to satisfy multiple‑process one‑stop material demands
✅ High bonding strength, outstanding temperature‑resistance, corrosion‑resistance and anti‑ageing capacity
✅ Self‑owned testing laboratory for independent performance verification
✅ Large‑scale production capacity plus flexible small‑batch customized development
✅ Dual‑region production bases in China and Southeast‑Asia, shortening delivery lead‑time and lowering cross‑border trade risks
✅ Full‑chain service: formula design, sample validation, bulk production and on‑site technical guidance
✅ Automotive‑grade quality certification for electronics, new‑energy vehicle and semiconductor high‑standard scenarios
✅ Local overseas offices and warehouses to deliver fast technical support and after‑sales service
Application:
Smartphones, wearable gadgets, speakers, drones and household appliances. Our materials work for display modules, camera components, circuit boards, flexible FPC boards and battery assemblies for frame bonding, sealing, reinforcement, lens fixation and dust‑proof protection.
Power batteries, ECU control units, automobile lamps, sensors and drive motors. Used for structural assembly, electromagnetic shielding, potting encapsulation, thermal conduction and housing sealing.
MEMS chips, IGBT power components, Mini‑LED panels, fingerprint and camera modules. Applied for die attachment, active‑alignment fixing, underfill encapsulation, edge sealing and chip‑level thin‑film bonding.
Package:
20ML、30ML、50ML、250ML、300ML、500ML
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