This series of high‑performance one‑component epoxy adhesives consists of two major product lines: low‑temperature‑cure type and heat‑cure type. Developed to follow the trend of slimmer, lighter and miniaturized electronic products, they are suitable for bonding low‑surface‑energy substrates such as FPC, PCB and LCP, as well as board‑level component protection.

The low‑temperature‑cure series enables fast curing at 70‑80°C, while heat‑cure grades deliver high reliability against drop, shock and thermal cycling. A wide selection of specialized formulations are available, including reworkable, low‑stress, low‑CTE, fluorescence‑detectable and auto‑dispensing grades. They are widely used in the assembly of consumer‑electronic products such as camera modules, fingerprint sensors, WLCSP, BGA chips and wearable devices.