High‑performance epoxy adhesives are developed to satisfy current and next‑generation demands of miniaturized, lightweight, thin‑profile consumer electronics. Our one‑component epoxy portfolio includes two main categories: Low‑Temperature Cure Epoxy and Heat‑Cure Epoxy. These adhesives deliver robust bonding performance on low‑surface‑energy substrates such as FPC, PCB and different‑grade LCP, and provide long‑term component‑level protection for electronic assemblies.
Low‑temperature‑cure grades can finish curing at 70‑80°C, avoiding thermal damage to heat‑sensitive components. Heat‑cure epoxy adhesives feature outstanding reliability against drop, shock, autoclave and thermal cycling. Reworkable, low‑stress, low‑CTE, fluorescent‑detectable and high‑flow formulations are available to solve your diverse bonding challenges.
