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Light Curable Adhesives

Light Curable Adhesives

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Light Curable Adhesives

Our full portfolio of light‑curable adhesives cures rapidly upon exposure to UV‑ultraviolet light. These versatile single‑component adhesives are well‑suited for high‑speed automated production. They deliver strong adhesion to a wide range of substrates and stable long‑term end‑use performance.

Three curing systems are available: UV‑only cure, UV‑moisture dual‑cure and UV‑thermal dual‑cure. Multiple viscosity grades cover different dispensing & gap‑filling requirements. Shadow‑area secondary curing (anaerobic / moisture cure) solves the problem of uncured hidden areas without UV exposure.

Our UV adhesives are ideal for metal‑to‑glass bonding, solder‑joint protection, LCD terminal reinforcement, wire reinforcement, camera‑module assembly, circuit‑board protection, conformal coating and FPCB reinforcement.

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General Common Features

  • Single‑component formulation, no mixing required

  • Fast cure under UV‑ultraviolet‑light irradiation

  • Multiple viscosity options to satisfy various dispensing & gap‑fill conditions

  • Formulated for adhesion on metal, ceramic, glass, plastic, PC, PVC, LCP, FPCB

  • Excellent long‑term end‑use performance

  • Shadow‑area secondary‑cure available (anaerobic / moisture cure) for hidden zones

  • Long shelf‑life under recommended cold‑storage condition

By Product Category 

✅ UV‑Only Cure

  • Fast one‑step UV curing

  • Wide‑range hardness selection from soft‑elastic Shore‑A to rigid Shore‑D

  • Non‑yellowing grades available for transparent parts

  • Flexible low‑modulus formulations for stress‑sensitive components

✅ UV‑Moisture Dual‑Cure

  • UV fast surface curing + moisture shadow‑curing for non‑transparent / shaded areas

  • Good aging‑resistance; conformal‑coating dedicated grades

  • High flexibility after full cure

✅ UV‑Thermal Dual‑Cure

  • UV rapid tack‑free surface cure + thermal post‑cure for shadow zones

  • High bond‑strength for hard‑to‑bond engineering plastics (LCP, PA, FR4)

  • Low‑stress, high‑impact‑resistant & good flux‑compatible options for chip assembly


  1. Three‑in‑one curing‑system selection：UV‑only / UV‑moisture / UV‑thermal dual‑cure options, fully solving shadow‑zone uncured issues.

  2. High‑speed production‑friendly：Instant UV curing greatly shortens cycle‑time and improves assembly throughput.

  3. Ultra‑wide substrate compatibility：One‑stop bonding solution for metal, glass, ceramic, PC, PVC, FPCB, LCP and hard‑to‑stick engineering plastics.

  4. Rich viscosity & hardness portfolio：From low‑viscosity flowable liquid to high‑viscosity thixotropic paste; from soft elastic gel to rigid high‑strength adhesive.

  5. Special functional grades available：Non‑yellowing, conformal‑coating, low‑stress flexible, solder‑flux compatible formulations for high‑end electronics.

  6. Long shelf‑life & stable performance：Most grades offer 12‑month shelf‑life at 8‑25℃, low material wastage for mass‑production.

  • Solder joint protection

  • LCD terminal reinforcement

  • Wire reinforcement

  • Camera‑module bonding

  • FPCB reinforcement

  • Metal‑to‑glass & metal‑to‑ceramic bonding

  • Plastic, PC, PVC component assembly

  • PCB conformal coating

  • Shaded‑area dual‑cure bonding for non‑transparent parts

  • High‑strength bonding for LCP, PA, FR‑4 engineering plastics

  • Low‑stress chip reinforcement for consumer electronics

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