Recommended Processing Conditions
For stable bonding, control more than just the adhesive temperature.
Adhesive Temperature
Typical application temperature is approximately 110–140°C.
Avoid overheating the adhesive for long periods because excessive heat exposure can affect viscosity and processing stability.
Substrate Temperature
Very cold materials can cause the molten PUR to cool too quickly, reducing wetting before the parts are joined.
Allow substrates to reach a suitable production temperature before bonding.
Surface Condition
Bonding surfaces should be:
● Clean
● Dry
● Free of dust
● Free of oil and release agents
Low-surface-energy plastics may require surface treatment or a specifically developed formulation.
Assembly Within Open Time
Complete positioning and pressing within the selected 2–10 minute open-time window.
If parts are joined after the adhesive has lost sufficient wetting ability, final bond performance may be reduced.
Pressure
Apply even pressure after assembly to achieve good contact between the adhesive and both substrates.
Available Forms
Jiwei PUR hot melt adhesive is available in different physical forms depending on equipment and application requirements:
Granules
Suitable for compatible industrial melting and dispensing systems.
Pillows
Convenient for industrial hot melt systems requiring controlled feeding.
Cartridges
Suitable for compatible cartridge applicators and lower-volume or precision assembly processes.
Please tell us your existing melter or dispensing equipment when requesting a product recommendation.
Storage & Handling
PUR is moisture reactive, so unopened packaging should be kept tightly sealed until use.
Recommended handling practices include:
● Store in a cool and dry environment
● Protect unopened adhesive from moisture
● Reseal partially used material whenever possible
● Avoid prolonged overheating in the melting equipment
● Remove cured adhesive from application equipment
● Use suitable PUR cleaning products for equipment maintenance
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