Our two‑component adhesive portfolio includes epoxy, acrylate and polyurethane structural bonding liquids. These products deliver outstanding flexibility in dispensing process, cure cycle and final performance.
Formulated for demanding applications requiring abrasion resistance, high bond strength, thermal stability and mechanical‑shock resistance, they cover a broad spectrum of mechanical, thermal and electrical properties.
Multiple curing options are available: heat, moisture, UV light or combined dual‑cure systems. Grades are offered with solvent‑free, halogen‑free formulations and can meet international standards such as UL and NSF.
They are widely used for structural assembly of dissimilar substrates including metal, plastic and display components for laptops and other consumer‑electronic devices.
