Our thermal conductive materials are silicone‑based and modified‑silyl polymer thermal interface materials, specially developed for electronic thermal management. Three functional series cover your different thermal‑dissipation workflows:
Thermal Potting Compound: Two‑component heat‑cure silicone for encapsulation, isolates heat and protects power modules.
Thermal Conductive Adhesive: 1‑part moisture‑cure bonding glue, bonds heatsink to components while transferring heat.
Gap Filler (Non‑curing thermal paste): Soft, stress‑free non‑crosslinking thermal gap filler, fills uneven gaps between heat‑generating parts and heat sinks.
A wide thermal‑conductivity range from 1.2 W/m·K up to 6.5 W/m·K is offered. All grades deliver low thermal resistance, low‑bleed oil‑free formula, great aging‑resistance after temperature‑humidity cycling and salt‑spray test. Non‑corrosive chemistry makes them suitable for sensitive PCB, FPC and precision electronic assemblies.
