PUR Hot Melt Adhesive (Polyurethane) is a reactive moisture curing adhesive known for–Strong Bonds and Exceptional Heat, Cold and Moisture-Resistance; this makes them an excellent choice for most difficult to bond, low energy substrates and they perform very well in extreme weather environments.

PUR adhesive, also known as polyurethane reactive adhesive or polyurethane hot melt adhesive is a one-component, 100% solid content, isocyanate (NCO) capped adhesive. When PUR adhesive glue contacts the moisture in the air, the polyurethane prepolymer reacts with the moisture in the air to cure and crosslink forming a strong bond.

EVA hot melt adhesive is the most popular, good performance/price, hot melt glue type. Its color varied from transparent, semi-transparent, to light yellow, white, black and colored. EVA based hot melt adhesives has good bonding capabilities over substrates of wood, paper, fabric, leather, metal and plastics.

Flat lamination is one of the oldest applications in the woodworking and furniture industry. It involves bonding a wood-based substrate with various decorative materials to enhance aesthetics, durability, or functionality. This process has become an industry standard for large-scale production.

Edge banding adhesive is a type of glue used in furniture manufacturing and woodworking to bond edge banding materials (such as PVC, ABS, wood veneer, or melamine) to the edges of panels (such as particleboard, MDF, or plywood). It enhances the appearance, durability, and moisture resistance of the finished product.

Profile Wrapping Adhesive is a type of adhesive used to bond decorative materials (such as films, decorative panels, wood veneers, etc.) to the surfaces of shaped substrates (such as wood, metal, PVC profiles, etc.). Through methods like hot melt or moisture curing, it securely wraps decorative materials onto substrates, widely used in industries like furniture, construction, doors, and windows to enhance product aesthetics and functionality.

Polyurethane Reactive (PUR) adhesive is a high-performance bonding material widely used in various industries, particularly in the lamination and structural assembly of honeycomb panels. PUR adhesives provide superior bonding strength, flexibility, and resistance to environmental factors, making them ideal for honeycomb board applications.

Textile adhesive is a high-performance bonding agent specifically developed for textile composite processing. It is widely used for bonding fabrics such as underwear materials, synthetic fibers, and recycled fibers. This adhesive is environmentally friendly, non-toxic, and solvent-free, providing excellent adhesion strength and water resistance while ensuring the softness and comfort of the bonded fabric.

3D laminating water-based polyurethane adhesive is a high-performance adhesive specially designed for bonding various plastic substrates. It is particularly suitable for 3D laminating applications, offering excellent adhesion, flexibility, and durability. This adhesive is ideal for bonding materials such as MDF, multilayer boards, composite boards, solid wood, and PVC, making it widely used in furniture manufacturing, cabinet production, and wooden door applications.

PUR cleaning agent is a specialized solution designed for effectively removing polyurethane reactive (PUR) adhesives from equipment, application tools, and surfaces. It features fast melting speed, excellent flowability, and strong cleaning ability, ensuring efficient maintenance and preventing adhesive buildup.

Jiwei New‑Material (HM) is a national high‑tech and specialized‑refined‑innovative manufacturer founded in 2009. We supply a full‑series industrial adhesive portfolio, covering reactive hot‑melt glue, epoxy adhesive, UV‑curing glue, structural adhesive, elastic sealant, thermal‑conductive material, conductive adhesive and adhesive film. With complete quality certifications, independent R‑D laboratory and overseas production bases in Malaysia and Vietnam, we deliver customized bonding solutions for consumer electronics, new‑energy automobile and semiconductor industries, serving clients from more than 20 countries worldwide.

HM's line of reactive hot melt adhesives includes products that are specifically designed for mobile device assembly. Our products are designed to cover a broad spectrum of applications from touch panel assembly to mobile phone parts bonding, by providing a range of performance characteristics including impact, chemical, moisture, and temperature resistance

This series of high‑performance one‑component epoxy adhesives consists of two major product lines: low‑temperature‑cure type and heat‑cure type. Developed to follow the trend of slimmer, lighter and miniaturized electronic products, they are suitable for bonding low‑surface‑energy substrates such as FPC, PCB and LCP, as well as board‑level component protection.

The low‑temperature‑cure series enables fast curing at 70‑80°C, while heat‑cure grades deliver high reliability against drop, shock and thermal cycling. A wide selection of specialized formulations are available, including reworkable, low‑stress, low‑CTE, fluorescence‑detectable and auto‑dispensing grades. They are widely used in the assembly of consumer‑electronic products such as camera modules, fingerprint sensors, WLCSP, BGA chips and wearable devices.

This series of single-component UV-curable adhesives cures rapidly upon exposure to ultraviolet light. The product line is divided into three main types: pure UV curing, UV moisture dual curing, and UV heat dual curing. A wide range of viscosities are available, and they exhibit excellent adhesion to various substrates including metals, glass, ceramics, LCP, FPCB, PC, and PVC. Anaerobic/moisture secondary curing is possible in shaded areas, making them suitable for high-speed automated production lines. Customized models with flexible low modulus, yellowing resistance, and low stress are also available, widely used in electronic assembly scenarios such as solder joint protection, LCD reinforcement, wire reinforcement, camera module bonding, circuit board protection, and conformal coating.

This series of two-component structural adhesives encompasses three major product lines: 2K epoxy resin, 2K acrylate, and 2K polyurethane, offering highly flexible customization options in terms of application methods, curing speeds, and product performance. They can meet demanding conditions requiring abrasion resistance, bond strength, temperature resistance, and mechanical shock resistance; heating, moisture, UV, or composite curing solutions are available. The products are solvent-free and halogen-free, possessing excellent dimensional stability, high peel strength, and chemical resistance. They are UL, NSF, and other industry certifications and are widely used in consumer electronics, laptop casings, displays, and structural bonding of dissimilar metal-plastic materials.

Our elastic sealing product portfolio covers silicone and modified‑silyl (STP / MS‑polymer) materials. They deliver reliable sealing and long‑term protection for electronic components, greatly extending service life and stability even under harsh working environments. With outstanding adhesion to plastic, metal, glass, ceramic and hard‑to‑bond low‑surface‑energy substrates, these flexible sealants are widely adopted for FIPG in‑situ‑formed‑gasket, conformal coating, ITO protection, PCB & FPC precision electronics sealing. Low‑modulus, low‑stress and non‑corrosive properties prevent sensitive circuits from damage.

Heat dissipation management has become a core challenge for miniaturized modern electronics. Our thermal‑conductive silicone & MS‑polymer product portfolio provides reliable non‑conductive thermal‑interface solutions, to stabilize long‑term performance and reliability for PCB assemblies and electronic components. Three major product categories are available: potting compound, thermal bonding adhesive and gap filler. Thermal conductivity grades range from low, medium to high. The paste is easy‑to‑dispense and rework‑friendly, featuring low‑stress, low‑bleed, excellent aging‑resistance and non‑corrosive formula, safe for PCB, FPC and precision electronics.

Our silver‑loaded electrically conductive adhesives deliver strong, long‑lasting electrical interconnection between electronic components and circuit‑boards. Multiple resin systems and curing profiles are available to meet diverse manufacturing requirements. Formulated for high‑reliability electronics, these adhesives provide stable electrical conduction, electromagnetic shielding and electrostatic‑discharge protection.

Reactive adhesive‑films are an advanced alternative to thermoplastic films, traditional hot‑melts and liquid adhesives, perfectly suited for soft‑goods assembly. Delivering thermoset‑grade performance in a convenient dry‑film form, these reactive films feature low curing‑activation temperatures that are gentle on heat‑sensitive substrates and will not damage delicate leather or micro‑fiber surfaces. With superior heat‑resistance and chemical‑resistance compared to ordinary thermoplastic adhesives, they create longer‑lasting bonded assemblies. This clean, simple adhesive technology requires no special application machinery, enabling manufacturers to deposit precise, controlled adhesive amounts exactly where bonding is needed.